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Solder Connections for High Frequency Applications Between Flexible and Rigid Printed Circuit Boards.
- Source :
-
IEEE Transactions on Components & Packaging Technologies . Mar2006, Vol. 29 Issue 1, p118-126. 9p. 1 Black and White Photograph, 20 Diagrams. - Publication Year :
- 2006
-
Abstract
- This article examines the backplane connector technology for high frequency use and presents a novel concept for shielded enclosures without air vents. The experimental soldering of connections between a flexible printed circuit (flex, for short) and a FR4-board as part of a backplane connector is presented. A very high contact density is reached by soldering vias on the flex to pads on the FR4; this soldering was performed both with ordinary Sn/Pb solder material and as well with lead-free solder alloy. The solder joints were examined using a scanning electron microscope (SEM) and the electrical properties of the flex/solder joint structure were measured. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 15213331
- Volume :
- 29
- Issue :
- 1
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Components & Packaging Technologies
- Publication Type :
- Academic Journal
- Accession number :
- 20245426
- Full Text :
- https://doi.org/10.1109/TCAPT.2005.853164