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MEPTEC'S ANNUAL MEMS PACKAGING SYMPOSIUM EXAMINES MARKET GROWTH.

Authors :
Goldstein, Julia
Source :
Advanced Packaging. Jul2006, Vol. 15 Issue 6, p10-12. 2p.
Publication Year :
2006

Abstract

Information about several papers discussed at the 4th Annual Microelectronics Packaging and Test Engineering Council symposium of Micro-Electronic-Mechanical Systems (MEMS) packaging on May 17-18, 2006 in San Francisco,California is presented. Market analyst, Mathieu Potin presented an analysis of the MEMS market and cited migration from MEMS devices to MEMS-based modules and the increasing penetration of MEMS into the consumer market as two major trends.

Details

Language :
English
ISSN :
10650555
Volume :
15
Issue :
6
Database :
Academic Search Index
Journal :
Advanced Packaging
Publication Type :
Periodical
Accession number :
21490328