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Supramolecular assembly driven by hydrogen-bonding and π–π stacking interactions based on copper(II)-terpyridyl complexes
- Source :
-
Inorganica Chimica Acta . Feb2007, Vol. 360 Issue 2, p588-598. 11p. - Publication Year :
- 2007
-
Abstract
- Abstract: Six 2D and 3D supramolecular complexes [Cu(L1)(O2CCH3)2]·H2O (1), [Cu2(L2)2(μ2-O2CCH3)2](BF4)2 (2), [Cu2(L1)2(BDC)(NO3)2]·0.5H2O (3) [Cu2(L2)2(BDC)(NO3)2] (4), [Cu2(L3)2(BDC)(NO3)2]·0.5H2O (5) and [Cu2(L2)2(BDC)(H2O)2](BDC)·8H2O (6) (L1 =4′-(4-pyridyl)-2,2′:6′,2″-terpyridine, L2 =4′-(2-pyridyl)-2,2′:6′,2″-terpyridine, L3 =4′-phenyl-2,2′:6′,2″-terpyridine, BDC=1,4-benzenedicarboxylate), have been prepared and structurally characterized by X-ray diffraction crystallography. In complexes 1, 3, and 4, 1D channels are formed through C–H⋯O and C–H⋯N hydrogen-bonding interactions, and further linked into 3D structure via C–H⋯O and O–H⋯O interactions. Complex 2 is a 2D layer constructed from intermolecular C–H⋯F and π–π stacking interactions. In the structure of 6, the BDC2− ions and solvent water molecules form a novel 2D layer containing left- and right-handed helical chains via hydrogen-bonds, and an unusual discrete water octamer is formed within the layer. In 2, 4, 6 and [Ag2(L2)2](PF6)2 (7) the bonding types of pendent pyridines of L2 depending on the twist about central pyridines are involved in intramolecular (2 and 4), intermolecular (6) or coordination bonds (7) in-twist-order of 5.8°, 3.7°, 28.2° and 38.0°, respectively. Differently, the pendent pyridines of L1 in 1 and 3 form intermolecular hydrogen bonds despite of distinct corresponding twist angles of 25.1° (1) and 42.6°(3). Meanwhile, π–π stacking interactions are present in 1–6 and responsible for the stabilization of these complexes. [Copyright &y& Elsevier]
Details
- Language :
- English
- ISSN :
- 00201693
- Volume :
- 360
- Issue :
- 2
- Database :
- Academic Search Index
- Journal :
- Inorganica Chimica Acta
- Publication Type :
- Academic Journal
- Accession number :
- 23672792
- Full Text :
- https://doi.org/10.1016/j.ica.2006.08.004