Corrections to "Enhancing the Reliability of Wafer Level Packaging by Using Solder Joints Layout Design".

MLA

Chang-Ming Liu, et al. “Corrections to ‘Enhancing the Reliability of Wafer Level Packaging by Using Solder Joints Layout Design.’” IEEE Transactions on Components & Packaging Technologies, vol. 30, no. 1, Mar. 2007, p. 190. EBSCOhost, https://doi.org/10.1109/TCAPT.2006.890539.

APA

Chang-Ming Liu, Chang-Chun Lee, & Kuo-Ning Chiang. (2007). Corrections to “Enhancing the Reliability of Wafer Level Packaging by Using Solder Joints Layout Design.” IEEE Transactions on Components & Packaging Technologies, 30(1), 190. https://doi.org/10.1109/TCAPT.2006.890539

Chicago

Chang-Ming Liu, Chang-Chun Lee, and Kuo-Ning Chiang. 2007. “Corrections to ‘Enhancing the Reliability of Wafer Level Packaging by Using Solder Joints Layout Design.’” IEEE Transactions on Components & Packaging Technologies 30 (1): 190. doi:10.1109/TCAPT.2006.890539.