High-resolution stress assessments of interconnect/dielectric electronic patterns using optically active point defects of silica glass as a stress sensor.

MLA

Leto, Andrea, et al. “High-Resolution Stress Assessments of Interconnect/Dielectric Electronic Patterns Using Optically Active Point Defects of Silica Glass as a Stress Sensor.” Journal of Applied Physics, vol. 101, no. 9, May 2007, p. 093514. EBSCOhost, https://doi.org/10.1063/1.2723193.

APA

Leto, A., Porporati, A. A., Zhu, W., Green, M., & Pezzotti, G. (2007). High-resolution stress assessments of interconnect/dielectric electronic patterns using optically active point defects of silica glass as a stress sensor. Journal of Applied Physics, 101(9), 093514. https://doi.org/10.1063/1.2723193

Chicago

Leto, Andrea, Alessandro Alan Porporati, Wenliang Zhu, Martin Green, and Giuseppe Pezzotti. 2007. “High-Resolution Stress Assessments of Interconnect/Dielectric Electronic Patterns Using Optically Active Point Defects of Silica Glass as a Stress Sensor.” Journal of Applied Physics 101 (9): 093514. doi:10.1063/1.2723193.