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Integration of trench-isolated through-wafer interconnects with 2d capacitive micromachined ultrasonic transducer arrays
- Source :
-
Sensors & Actuators A: Physical . Jul2007, Vol. 138 Issue 1, p221-229. 9p. - Publication Year :
- 2007
-
Abstract
- Abstract: This paper presents a method to provide electrical connection to a 2D capacitive micromachined ultrasonic transducer (CMUT) array. The interconnects are processed after the CMUTs are fabricated on the front side of a silicon wafer. Connections to array elements are made from the back side of the substrate via highly conductive silicon pillars that result from a deep reactive ion etching (DRIE) process. Flip-chip bonding is used to integrate the CMUT array with an integrated circuit (IC) that comprises the front-end circuits for the transducer and provides mechanical support for the trench-isolated array elements. Design, fabrication process and characterization results are presented. The advantages when compared to other through-wafer interconnect techniques are discussed. [Copyright &y& Elsevier]
- Subjects :
- *SEMICONDUCTOR wafers
*ELECTRONIC circuits
*MICROMACHINING
*ULTRASONIC equipment
Subjects
Details
- Language :
- English
- ISSN :
- 09244247
- Volume :
- 138
- Issue :
- 1
- Database :
- Academic Search Index
- Journal :
- Sensors & Actuators A: Physical
- Publication Type :
- Academic Journal
- Accession number :
- 25618810
- Full Text :
- https://doi.org/10.1016/j.sna.2007.04.008