Analytical solution of thermal resistance of vapor chamber heat sink with and without pillar

Abstract: A three dimensional analytical solution using product solutions via the separation of variables for spreading thermal resistances of centrally positioned heat sources of a vapor chamber heat sink with and without a partition for electronic cooling is presented. Parametric study including partition thickness and height was performed, and the effect of the relevant parameters on the heat transfer performance in terms of the base spreading resistance was examined. [Copyright &y& Elsevier]