Cite
Board level drop test and simulation of leaded and lead-free BGA-PCB assembly
MLA
Qu, Xin, et al. “Board Level Drop Test and Simulation of Leaded and Lead-Free BGA-PCB Assembly.” Microelectronics Reliability, vol. 47, no. 12, Dec. 2007, pp. 2197–204. EBSCOhost, https://doi.org/10.1016/j.microrel.2006.10.017.
APA
Qu, X., Chen, Z., Qi, B., Lee, T., & Wang, J. (2007). Board level drop test and simulation of leaded and lead-free BGA-PCB assembly. Microelectronics Reliability, 47(12), 2197–2204. https://doi.org/10.1016/j.microrel.2006.10.017
Chicago
Qu, Xin, Zhaoyi Chen, Bo Qi, Taekoo Lee, and Jiaji Wang. 2007. “Board Level Drop Test and Simulation of Leaded and Lead-Free BGA-PCB Assembly.” Microelectronics Reliability 47 (12): 2197–2204. doi:10.1016/j.microrel.2006.10.017.