Aluminium-based packaging platform for LED using selectively anodising method.

An aluminium-based packaging platform with microreflector and electrical via for an interconnection electrode is first proposed for a package component of a light-emitting diode (LED). The electrode-guided interconnection with 180 µm thickness has been successfully fabricated by using the selectively anodising process, and not by either the plating or the solder paste technique. The reflector was formed during the isotropic etching process. By mainly a two-step chemical process, the LED packaging platform integrated microreflector and electrical via in one body was developed in a low-cost process. [ABSTRACT FROM AUTHOR]