Back to Search
Start Over
Large-area unmodified superhydrophobic copper substrate can be prepared by an electroless replacement deposition
- Source :
-
Journal of Colloid & Interface Science . Jan2009, Vol. 329 Issue 1, p208-211. 4p. - Publication Year :
- 2009
-
Abstract
- Abstract: Using an electroless replacement deposition method, large-area superhydrophobic metal substrate could be obtained. The superhydrophobic surfaces were prepared via a replacement reaction between copper substrate and HAuCl4 solution. The roughness of the copper substrate increased much after the replacement reaction. X-ray powder diffraction (XRD) pattern and energy dispersive X-ray (EDX) spectroscopy have proved that gold, CuCl and Cu2O formed on the surface of copper substrate after the replacement reaction. The surface showed remarkable superhydrophobic properties with a contact angle higher than 150 degrees without any modification with a self-assembled monolayer (SAM) of long chain thiol or perfluoro molecules. [Copyright &y& Elsevier]
Details
- Language :
- English
- ISSN :
- 00219797
- Volume :
- 329
- Issue :
- 1
- Database :
- Academic Search Index
- Journal :
- Journal of Colloid & Interface Science
- Publication Type :
- Academic Journal
- Accession number :
- 35164344
- Full Text :
- https://doi.org/10.1016/j.jcis.2008.09.059