Simulations of Thermomechanical Stresses and Optical Misalignment in 1550-nm Transmitter Optoelectronic Modules Using FEM and Process Dispersions.

MLA

Deshayes, Yannick, et al. “Simulations of Thermomechanical Stresses and Optical Misalignment in 1550-Nm Transmitter Optoelectronic Modules Using FEM and Process Dispersions.” IEEE Transactions on Components & Packaging Technologies, vol. 31, no. 4, Dec. 2008, pp. 759–66. EBSCOhost, https://doi.org/10.1109/TCAPT.2008.2001173.

APA

Deshayes, Y., Bechou, L., Verdier, F., Ousten, Y., Laffitte, D., & Goudard, J. L. (2008). Simulations of Thermomechanical Stresses and Optical Misalignment in 1550-nm Transmitter Optoelectronic Modules Using FEM and Process Dispersions. IEEE Transactions on Components & Packaging Technologies, 31(4), 759–766. https://doi.org/10.1109/TCAPT.2008.2001173

Chicago

Deshayes, Yannick, Laurent Bechou, F. Verdier, Yves Ousten, D. Laffitte, and J. L. Goudard. 2008. “Simulations of Thermomechanical Stresses and Optical Misalignment in 1550-Nm Transmitter Optoelectronic Modules Using FEM and Process Dispersions.” IEEE Transactions on Components & Packaging Technologies 31 (4): 759–66. doi:10.1109/TCAPT.2008.2001173.