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Special Section, on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High-Performance Applications.
- Source :
-
IEEE Transactions on Advanced Packaging . Nov2008, Vol. 31 Issue 4, p662-663. 2p. 2 Black and White Photographs. - Publication Year :
- 2008
-
Abstract
- A foreword to "IEEE Transactions on Advanced Packaging" vol. 31 is presented.
- Subjects :
- *PREFACES & forewords
*ELECTRONIC systems
Subjects
Details
- Language :
- English
- ISSN :
- 15213323
- Volume :
- 31
- Issue :
- 4
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Advanced Packaging
- Publication Type :
- Academic Journal
- Accession number :
- 35760470
- Full Text :
- https://doi.org/10.1109/TADVP.2008.2009342