Cite
Silicon-on-Organic Integration of a 2.4-GHz VCO Using High-Q Copper Inductors and Solder-Bumped Flip Chip Technology.
MLA
Xiao Huo, et al. “Silicon-on-Organic Integration of a 2.4-GHz VCO Using High-Q Copper Inductors and Solder-Bumped Flip Chip Technology.” IEEE Transactions on Components & Packaging Technologies, vol. 32, no. 1, Mar. 2009, pp. 191–96. EBSCOhost, https://doi.org/10.1109/TCAPT.2008.2007653.
APA
Xiao Huo, Guo-Wei Xiao, Chan, P. H., & Chen, K. J. (2009). Silicon-on-Organic Integration of a 2.4-GHz VCO Using High-Q Copper Inductors and Solder-Bumped Flip Chip Technology. IEEE Transactions on Components & Packaging Technologies, 32(1), 191–196. https://doi.org/10.1109/TCAPT.2008.2007653
Chicago
Xiao Huo, Guo-Wei Xiao, Philip H. Chan, and Kevin J. Chen. 2009. “Silicon-on-Organic Integration of a 2.4-GHz VCO Using High-Q Copper Inductors and Solder-Bumped Flip Chip Technology.” IEEE Transactions on Components & Packaging Technologies 32 (1): 191–96. doi:10.1109/TCAPT.2008.2007653.