Cite
FAILURE BEHAVIORS OF FLIP CHIP SOLDER JOINTS UNDER VARIOUS LOADING CONDITIONS OF HIGH-SPEED SHEAR TEST.
MLA
Sang-Su Ha, et al. “Failure Behaviors of Flip Chip Solder Joints under Various Loading Conditions of High-Speed Shear Test.” International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, vol. 23, no. 6/7, Mar. 2009, pp. 1809–15. EBSCOhost, https://doi.org/10.1142/S0217979209061664.
APA
Sang-Su Ha, Sang-Ok Ha, Jin-Kyu Jang, Jong-Woong Kim, Jong-Bum Lee, & Seung-Boo Jung. (2009). Failure Behaviors of Flip Chip Solder Joints under Various Loading Conditions of High-Speed Shear Test. International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 23(6/7), 1809–1815. https://doi.org/10.1142/S0217979209061664
Chicago
Sang-Su Ha, Sang-Ok Ha, Jin-Kyu Jang, Jong-Woong Kim, Jong-Bum Lee, and Seung-Boo Jung. 2009. “Failure Behaviors of Flip Chip Solder Joints under Various Loading Conditions of High-Speed Shear Test.” International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics 23 (6/7): 1809–15. doi:10.1142/S0217979209061664.