DISTRIBUTION AND CORROSION BEHAVIORS OF THE TRIPLE JUNCTIONS IN A GRAIN BOUNDARY ENGINEERED 304 STAINLESS STEEL.

Grain boundary character distribution (GBCD) and triple junction character distribution (TJCD) in a 304 stainless steel cold rolled with the thickness reduction of 6% and then annealed at 1323K for 5 minutes(GBE process) were analyzed by electron back scatter diffraction (EBSD). The intergranular corrosion (IGC) resistance of various triple junctions and grain boundaries were evaluated after sensitization treatment at 1073K for 30 minutes. The results showed special TJ containing 2 or 3 CSL boundaries exhibit higher resistance to IGC than other TJs. In addition, the {411} and {221} symmetrical tilt grain boundaries (STGBs) are more resistant to intergranular corrosion for Σ9 boundaries. [ABSTRACT FROM AUTHOR]