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Modeling and Simulation of Integrated Capacitors for High Frequency Chip Power Decoupling.
- Source :
-
IEEE Transactions on Components & Packaging Technologies . Dec2000, Vol. 23 Issue 4, p611. 9p. 1 Black and White Photograph, 6 Diagrams, 2 Charts, 8 Graphs. - Publication Year :
- 2000
-
Abstract
- Presents information on a study which discussed a modeling approach for integrated capacitors based on the partial-element-equivalent-circuit formulation. Modeling methodology; Electrical measurements and model verification; Simulation case studies on the 3M C-Ply technology.
- Subjects :
- *CAPACITORS
*ELECTRIC equipment
*STANDARDS
Subjects
Details
- Language :
- English
- ISSN :
- 15213331
- Volume :
- 23
- Issue :
- 4
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Components & Packaging Technologies
- Publication Type :
- Academic Journal
- Accession number :
- 3928562