Larger packages fuel thermal strategies.

Authors :: Chapman, Christopher
Source :: Electronic Engineering Times (01921541). 03/23/98, Issue 999, p104. 2p. 1 Color Photograph.
Publication Year :: 1998
Abstract: Focuses on the trend toward surface-mount assembly processes that makes ball-grid array (BGA) packaging a choice for many types of devices. Advantage of BGA packaging; Why several manufacturers are incorporating heat spreaders into their BGA packages; How companies maintain the cost of complex devices with the use of BGA packaging.