Cite
Pad flattening ratio, coefficient of friction and removal rate analysis during silicon dioxide chemical mechanical planarization
MLA
Lee, H., et al. “Pad Flattening Ratio, Coefficient of Friction and Removal Rate Analysis during Silicon Dioxide Chemical Mechanical Planarization.” Thin Solid Films, vol. 518, no. 8, Feb. 2010, pp. 1994–2000. EBSCOhost, https://doi.org/10.1016/j.tsf.2009.07.193.
APA
Lee, H., Zhuang, Y., Sugiyama, M., Seike, Y., Takaoka, M., Miyachi, K., Nishiguchi, T., Kojima, H., & Philipossian, A. (2010). Pad flattening ratio, coefficient of friction and removal rate analysis during silicon dioxide chemical mechanical planarization. Thin Solid Films, 518(8), 1994–2000. https://doi.org/10.1016/j.tsf.2009.07.193
Chicago
Lee, H., Y. Zhuang, M. Sugiyama, Y. Seike, M. Takaoka, K. Miyachi, T. Nishiguchi, H. Kojima, and A. Philipossian. 2010. “Pad Flattening Ratio, Coefficient of Friction and Removal Rate Analysis during Silicon Dioxide Chemical Mechanical Planarization.” Thin Solid Films 518 (8): 1994–2000. doi:10.1016/j.tsf.2009.07.193.