Atomic layer deposition goes main-stream in 22nm logic technologies.

The article discusses the use of atomic layer deposition (ALD) in 22nn logic process flow in the U.S. It states that each of the application space will create a need for configuration of manufacturing equipment and variations in technology. It notes that ALD chambers are ideal when an application demands thin films with exact thickness and uniformity. It also mentions that ALD have high precursor utilization efficiencies.