Cite
Capillary-driven automatic packagingElectronic supplementary information (ESI) available: Calculation of the liquid film loading, a microscopic image of Vernier alignment markers, and a proposed CAP-enabled fabrication process for large-scale integrated microfluidics. See DOI: 10.1039/c0lc00710b
MLA
Yuzhe Ding, et al. “Capillary-Driven Automatic PackagingElectronic Supplementary Information (ESI) Available: Calculation of the Liquid Film Loading, a Microscopic Image of Vernier Alignment Markers, and a Proposed CAP-Enabled Fabrication Process for Large-Scale Integrated Microfluidics. See DOI: 10.1039/C0lc00710b.” Lab on a Chip, vol. 11, no. 8, Apr. 2011, pp. 1464–69. EBSCOhost, https://doi.org/10.1039/c0lc00710b.
APA
Yuzhe Ding, Lingfei Hong, Baoqing Nie, Kit S. Lam, & Tingrui Pan. (2011). Capillary-driven automatic packagingElectronic supplementary information (ESI) available: Calculation of the liquid film loading, a microscopic image of Vernier alignment markers, and a proposed CAP-enabled fabrication process for large-scale integrated microfluidics. See DOI: 10.1039/c0lc00710b. Lab on a Chip, 11(8), 1464–1469. https://doi.org/10.1039/c0lc00710b
Chicago
Yuzhe Ding, Lingfei Hong, Baoqing Nie, Kit S. Lam, and Tingrui Pan. 2011. “Capillary-Driven Automatic PackagingElectronic Supplementary Information (ESI) Available: Calculation of the Liquid Film Loading, a Microscopic Image of Vernier Alignment Markers, and a Proposed CAP-Enabled Fabrication Process for Large-Scale Integrated Microfluidics. See DOI: 10.1039/C0lc00710b.” Lab on a Chip 11 (8): 1464–69. doi:10.1039/c0lc00710b.