Cite
Prognostication of Residual Life and Latent Damage Assessment in Lead-Free Electronics Under Thermomechanical Loads.
MLA
Lall, Pradeep, et al. “Prognostication of Residual Life and Latent Damage Assessment in Lead-Free Electronics Under Thermomechanical Loads.” IEEE Transactions on Industrial Electronics, vol. 58, no. 7, July 2011, pp. 2605–16. EBSCOhost, https://doi.org/10.1109/TIE.2010.2089936.
APA
Lall, P., Bhat, C., Hande, M., More, V., Vaidya, R., & Goebel, K. (2011). Prognostication of Residual Life and Latent Damage Assessment in Lead-Free Electronics Under Thermomechanical Loads. IEEE Transactions on Industrial Electronics, 58(7), 2605–2616. https://doi.org/10.1109/TIE.2010.2089936
Chicago
Lall, Pradeep, Chandan Bhat, Madhura Hande, Vikrant More, Rahul Vaidya, and Kai Goebel. 2011. “Prognostication of Residual Life and Latent Damage Assessment in Lead-Free Electronics Under Thermomechanical Loads.” IEEE Transactions on Industrial Electronics 58 (7): 2605–16. doi:10.1109/TIE.2010.2089936.