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Hierarchical Simulation of Process Variations and Their Impact on Circuits and Systems: Methodology.

Authors :
Lorenz, Jürgen K.
Bar, Eberhard
Clees, Tanja
Jancke, Roland
Salzig, Christian P. J.
Selberherr, Siegfried
Source :
IEEE Transactions on Electron Devices. Aug2011, Vol. 58 Issue 8, p2218-2226. 9p.
Publication Year :
2011

Abstract

Process variations increasingly challenge the manufacturability of advanced devices and the yield of integrated circuits. Technology computer-aided design (TCAD) has the potential to make key contributions to minimize this problem, by assessing the impact of certain variations on the device, circuit, and system. In this way, TCAD can provide the information necessary to decide on investments in the processing level or the adoption of a more variation tolerant process flow, device architecture, or design on circuit or chip level. In this first of two consecutive papers, sources of process variations and the state of the art of related simulation tools are reviewed. An approach for hierarchical simulation of process variations including their correlations is presented. The second paper, also published in this issue, presents examples of simulation results obtained with this methodology. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00189383
Volume :
58
Issue :
8
Database :
Academic Search Index
Journal :
IEEE Transactions on Electron Devices
Publication Type :
Academic Journal
Accession number :
63244819
Full Text :
https://doi.org/10.1109/TED.2011.2150225