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High-energy (MeV) Al and B ion implantations into 4H-SiC and fabrication of pin diodes.
- Source :
-
Journal of Applied Physics . 4/1/2002, Vol. 91 Issue 7, p4242. 7p. 2 Black and White Photographs, 3 Charts, 7 Graphs. - Publication Year :
- 2002
-
Abstract
- High-energy (MeV) implantation of Al[sup +] or B[sup +] into 4H-SiC epilayers has been investigated. A 3 µm deep pn junction was formed by multiple-step Al[sup +] or B[sup +] implantation with implantation energies up to 6.2 or 3.4 MeV, respectively. Rutherford backscattering channeling and cross-sectional transmission electron microscopy analyses have revealed residual damages in the implanted layers even after high-temperature annealing at 1600-1800 °C. Nevertheless, high electrical activation ratios over 90% have been achieved for both Al[sup +] - and B[sup +]-implanted layers by annealing at 1800 °C. Mesa pin diodes with a 15-µm-thick i layer formed by MeV implantation have exhibited high breakdown voltages of 2860-3080 V. The reverse characteristics of diodes have been substantially improved by increasing annealing temperature up to 1800 °C. The diode performance is discussed with the results of deep level analyses near the junctions. [ABSTRACT FROM AUTHOR]
- Subjects :
- *SEMICONDUCTORS
*BACKSCATTERING
*TRANSMISSION electron microscopes
Subjects
Details
- Language :
- English
- ISSN :
- 00218979
- Volume :
- 91
- Issue :
- 7
- Database :
- Academic Search Index
- Journal :
- Journal of Applied Physics
- Publication Type :
- Academic Journal
- Accession number :
- 6408083
- Full Text :
- https://doi.org/10.1063/1.1459096