Cite
Thermal optimization of GaN-on-Si HEMTs with plastic package
MLA
Liu, R., et al. “Thermal Optimization of GaN-on-Si HEMTs with Plastic Package.” Microelectronics Reliability, vol. 51, no. 9–11, Sept. 2011, pp. 1788–91. EBSCOhost, https://doi.org/10.1016/j.microrel.2011.06.033.
APA
Liu, R., Schreurs, D., De Raedt, W., Vanaverbeke, F., Mertens, R., & De Wolf, I. (2011). Thermal optimization of GaN-on-Si HEMTs with plastic package. Microelectronics Reliability, 51(9–11), 1788–1791. https://doi.org/10.1016/j.microrel.2011.06.033
Chicago
Liu, R., D. Schreurs, W. De Raedt, F. Vanaverbeke, R. Mertens, and I. De Wolf. 2011. “Thermal Optimization of GaN-on-Si HEMTs with Plastic Package.” Microelectronics Reliability 51 (9–11): 1788–91. doi:10.1016/j.microrel.2011.06.033.