Cite
Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS
MLA
Wang, B., et al. “Outgassing Study of Thin Films Used for Poly-SiGe Based Vacuum Packaging of MEMS.” Microelectronics Reliability, vol. 51, no. 9–11, Sept. 2011, pp. 1878–81. EBSCOhost, https://doi.org/10.1016/j.microrel.2011.06.022.
APA
Wang, B., Tanaka, S., Guo, B., Vereecke, G., Severi, S., Witvrouw, A., Wevers, M., & De Wolf, I. (2011). Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS. Microelectronics Reliability, 51(9–11), 1878–1881. https://doi.org/10.1016/j.microrel.2011.06.022
Chicago
Wang, B., S. Tanaka, B. Guo, G. Vereecke, S. Severi, A. Witvrouw, M. Wevers, and I. De Wolf. 2011. “Outgassing Study of Thin Films Used for Poly-SiGe Based Vacuum Packaging of MEMS.” Microelectronics Reliability 51 (9–11): 1878–81. doi:10.1016/j.microrel.2011.06.022.