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Adhesion Issues in Flip-Chip on Organic Modules.
- Source :
-
IEEE Transactions on Components & Packaging Technologies . Dec99, Vol. 22 Issue 4, p519. 6p. 2 Diagrams, 3 Charts, 7 Graphs. - Publication Year :
- 1999
-
Abstract
- Examines the factors affecting adhesion in flip-chip packages. Description of the modified fracture toughness testing (MFTT) method; Equation for calculating a modidied or apparent fracture toughness; Effect on MFFT of curing at different temperatures; Effect of temperature/humidity conditioning on interfacial adhesion.
- Subjects :
- *ADHESION
*FRACTURE mechanics
*ELECTRONIC packaging
Subjects
Details
- Language :
- English
- ISSN :
- 15213331
- Volume :
- 22
- Issue :
- 4
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Components & Packaging Technologies
- Publication Type :
- Academic Journal
- Accession number :
- 7231115
- Full Text :
- https://doi.org/10.1109/6144.814967