A Compact Analytic Model of the Strain Field Induced by Through Silicon Vias.

The thermoelastic strains are induced by through silicon vias due to the difference of thermal expansion coefficients between the copper (\sim\!\!\18\ \ppm/^\circ \C) and silicon (\sim\!\!\2.8\ \ppm/^\circ \C) when the structures are exposed to a thermal ramp in the process flow. A compact analytic model (Bessel function) of the strain field is obtained using Kane–Mindlin theory, and has a good agreement with the finite-element simulations. The elastic strains in the silicon in the radial direction and angular direction are tensile and compressive, respectively. The linear superposition of the analytic model of a single via can be used in the multi-via configuration. Due to the interaction of vias, the slightly larger errors of strain occur between the two close vias when the linear superposition is used. [ABSTRACT FROM AUTHOR]