Depth profiles of cluster-ion-implanted BSi in silicon

In this study, BSi cluster ions of 77 keV and B monomer ions of 22 keV were respectively implanted into silicon wafers at room temperature and geometrically tilted. Rapid thermal annealing of the as-implanted specimens at 1050 <f>°</f>C for 25 s was also employed. The results revealed that all the as-implanted and as-annealed range parameters (<f>Rp</f>, <f>ΔRp</f>, <f>γ</f>, <f>β</f> and <f>ΔRt</f>) of the BSi cluster ion implantation are smaller than those of the B monomer ion implantation. The as-annealed range parameters are larger than the as-implanted ones for both the BSi cluster ion and the B monomer ion implantations mainly due to radiation enhanced diffusion (RED) effects. RED effects also tend to drive boron atoms out-diffusion towards the specimen surface. However, the SiO<f>2</f> layer at the surface acts as a diffusion barrier by which it traps boron atoms nearby. The existence of larger amounts of defects explains the presence of a more pronounced accumulation of out-diffused boron atoms in the as-annealed boron depth profile of the BSi cluster ion implantation compared to that of the B monomer ion implantation. [Copyright &y& Elsevier]