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Surface-Tension-Driven Self-Assembly of 3-D Microcomponents by Using Laser Reflow Soldering and Wire Limiting Mechanisms.
- Source :
-
IEEE Transactions on Components, Packaging & Manufacturing Technology . Jan2013, Vol. 3 Issue 1, p168-176. 9p. - Publication Year :
- 2013
-
Abstract
- This paper proposes a surface-tension-driven self-assembly method for manufacturing highly 3-D microstructures in microelectromechanical systems (MEMS). By using laser reflow soldering, various MEMS microstructures, even including the thermal-sensitive components, are able to be effectively assembled. Moreover, an energy-based numerical model is established for predicting the equilibrium geometry of a self-assembled structure. Based on the calculated results of energy and torque, an analysis is carried out on the factors affecting the self-assembled equilibrium position. In addition, the self-assembly process is also investigated experimentally by fabricating a popped-up microstructure with two light-emitting diodes die. Experimental studies, combined with the modeling results, have demonstrated that the self-assembly angle can be controlled within \pm2.5^\circ. Furthermore, in order to enhance the precision of self-assembly, a novel low-cost wire limiter structure fabricated by the wire bonding process is presented, which reduces the assembly angle variation down to \pm0.5^\circ. [ABSTRACT FROM PUBLISHER]
Details
- Language :
- English
- ISSN :
- 21563950
- Volume :
- 3
- Issue :
- 1
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Components, Packaging & Manufacturing Technology
- Publication Type :
- Academic Journal
- Accession number :
- 84742517
- Full Text :
- https://doi.org/10.1109/TCPMT.2012.2221126