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Stretchable Electronics Technology for Large Area Applications: Fabrication and Mechanical Characterization.
- Source :
-
IEEE Transactions on Components, Packaging & Manufacturing Technology . Feb2013, Vol. 3 Issue 2, p229-235. 7p. - Publication Year :
- 2013
-
Abstract
- The development and mechanical characterization of a novel technology for stretchable electronics is presented, which can be used for the realization of wearable textile electronics and biomedical implants. The stretchable devices consist of rigid or flexible component islands interconnected with stretchable meander-shaped copper conductors embedded in a stretchable polymer, polydemethylsiloxane. The technology uses standard printed circuit board manufacturing steps and liquid injection molding techniques to achieve a robust and reliable product. The conductors in the device are designed to accommodate strains up to 10–15%. Spin-on photo-definable polyimide as mechanical support for the stretchable interconnects and the functional flexible islands are introduced. By use of polyimide, the reliability of the stretchable interconnects, the straight interconnects on the flexible islands and the transitions between the stretchable and nonstretchable parts are improved. Long-term endurance behavior of the stretchable interconnects is studied by cyclic elongation at strain ranges of up to 20% while monitoring the electrical connectivity. It's shown that the lifetime of the polyimide supported interconnects is at least two times better compared to the nonsupported. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 21563950
- Volume :
- 3
- Issue :
- 2
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Components, Packaging & Manufacturing Technology
- Publication Type :
- Academic Journal
- Accession number :
- 85276993
- Full Text :
- https://doi.org/10.1109/TCPMT.2012.2185792