Cite
Influences of the moisture absorption on PBGA package’s warpage during IR reflow process
MLA
Chien, Chi-Hui, et al. “Influences of the Moisture Absorption on PBGA Package’s Warpage during IR Reflow Process.” Microelectronics Reliability, vol. 43, no. 1, Jan. 2003, p. 131. EBSCOhost, https://doi.org/10.1016/S0026-2714(02)00283-4.
APA
Chien, C.-H., Chen, Y.-C., Chiou, Y.-T., Chen, T., Hsieh, C.-C., Yan, J.-J., Chen, W.-Z., & Wu, Y.-D. (2003). Influences of the moisture absorption on PBGA package’s warpage during IR reflow process. Microelectronics Reliability, 43(1), 131. https://doi.org/10.1016/S0026-2714(02)00283-4
Chicago
Chien, Chi-Hui, Yung-Chang Chen, Yii-Tay Chiou, Thaiping Chen, Chi-Chang Hsieh, Jia-Jin Yan, Wei-Zhi Chen, and Yii-Der Wu. 2003. “Influences of the Moisture Absorption on PBGA Package’s Warpage during IR Reflow Process.” Microelectronics Reliability 43 (1): 131. doi:10.1016/S0026-2714(02)00283-4.