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The Premier of EDI CON.
- Source :
-
Microwave Journal . May2013, Vol. 56 Issue 5, p94-102. 5p. - Publication Year :
- 2013
-
Abstract
- The article discusses the Electronic Design Innovation Conference (EDI CON) held at the Beijing International Convention Center, China in March 2013. It highlights the keynote talks and technical sessions on topics including "Present and Future of RF/Microwave and High-Speed Digital Devices and Systems," the global perspective of the satellite communication developments, and "Microwave Technology from Backhaul to Access - Opportunity for Mobile Communications."
Details
- Language :
- English
- ISSN :
- 01926225
- Volume :
- 56
- Issue :
- 5
- Database :
- Academic Search Index
- Journal :
- Microwave Journal
- Publication Type :
- Periodical
- Accession number :
- 87658636