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The Premier of EDI CON.

Authors :
VYE, DAVID
Source :
Microwave Journal. May2013, Vol. 56 Issue 5, p94-102. 5p.
Publication Year :
2013

Abstract

The article discusses the Electronic Design Innovation Conference (EDI CON) held at the Beijing International Convention Center, China in March 2013. It highlights the keynote talks and technical sessions on topics including "Present and Future of RF/Microwave and High-Speed Digital Devices and Systems," the global perspective of the satellite communication developments, and "Microwave Technology from Backhaul to Access - Opportunity for Mobile Communications."

Details

Language :
English
ISSN :
01926225
Volume :
56
Issue :
5
Database :
Academic Search Index
Journal :
Microwave Journal
Publication Type :
Periodical
Accession number :
87658636