Cite
Investigation of interconnect design on interfacial cracking energy of Al/TiN barriers under a flexural load.
MLA
Lee, Chang-Chun, et al. “Investigation of Interconnect Design on Interfacial Cracking Energy of Al/TiN Barriers under a Flexural Load.” Thin Solid Films, vol. 544, Oct. 2013, pp. 530–36. EBSCOhost, https://doi.org/10.1016/j.tsf.2013.01.025.
APA
Lee, C.-C., Su, Y.-F., Wu, C.-S., & Chiang, K.-N. (2013). Investigation of interconnect design on interfacial cracking energy of Al/TiN barriers under a flexural load. Thin Solid Films, 544, 530–536. https://doi.org/10.1016/j.tsf.2013.01.025
Chicago
Lee, Chang-Chun, Yen-Fu Su, Chih-Sheng Wu, and Kuo-Ning Chiang. 2013. “Investigation of Interconnect Design on Interfacial Cracking Energy of Al/TiN Barriers under a Flexural Load.” Thin Solid Films 544 (October): 530–36. doi:10.1016/j.tsf.2013.01.025.