Structural and compositional effects on thermal expansion behavior in polyimide substrates of varying thicknesses.

Highlights: [•] Thermal expansion for rigid and planar polyimides depends on film thickness. [•] Charge transfer complex is formed more favorably at thinner films. [•] Variable thermal expansion originates from complex morphological effects. [•] Variable thermal expansion provides optimum film thickness for display substrates. [Copyright &y& Elsevier]