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Abrasive and additive interactions in high selectivity STI CMP slurries.
- Source :
-
Microelectronic Engineering . Feb2014, Vol. 114, p98-104. 7p. - Publication Year :
- 2014
-
Abstract
- Highlights: [•] Silicon dioxide to silicon nitride removal rate selectivity evaluated. [•] Ceria purity and crystal structure influence selectivity. [•] l-glutamic acid yields high selectivity with all ceria and is robust. [•] l-proline yields high selectivity only with one ceria and is less robust. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 01679317
- Volume :
- 114
- Database :
- Academic Search Index
- Journal :
- Microelectronic Engineering
- Publication Type :
- Academic Journal
- Accession number :
- 92650677
- Full Text :
- https://doi.org/10.1016/j.mee.2013.10.004