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Packaging conference high on chip-on-board.
- Source :
-
Electronic Engineering Times (01921541) . 9/6/93, Issue 762, p1. 2p. 1 Graph. - Publication Year :
- 1993
-
Abstract
- Reports on the agenda of the International Electronic Packaging Society conference on September 12-15, 1993 in San Diego, California. Chip-on-board interconnection; Advances in conventional single-chip packages; Motorola's direct chip attach; Availability of viable infrastructure; Cost in comparison with standard packaging.
- Subjects :
- *ELECTRONIC packaging
*SOCIETIES
*TECHNOLOGICAL innovations
Subjects
Details
- Language :
- English
- ISSN :
- 01921541
- Issue :
- 762
- Database :
- Academic Search Index
- Journal :
- Electronic Engineering Times (01921541)
- Publication Type :
- Periodical
- Accession number :
- 9312030611