Cite
Thin-film encapsulation technology for above-IC MEMS wafer-level packaging.
MLA
Zhang, Qing, et al. “Thin-Film Encapsulation Technology for above-IC MEMS Wafer-Level Packaging.” Journal of Micromechanics & Microengineering, vol. 23, no. 12, Dec. 2013, pp. 125012–21. EBSCOhost, https://doi.org/10.1088/0960-1317/23/12/125012.
APA
Zhang, Q., Cicek, P.-V., Nabki, F., & El-Gamal, M. (2013). Thin-film encapsulation technology for above-IC MEMS wafer-level packaging. Journal of Micromechanics & Microengineering, 23(12), 125012–125021. https://doi.org/10.1088/0960-1317/23/12/125012
Chicago
Zhang, Qing, Paul-Vahé Cicek, Frederic Nabki, and Mourad El-Gamal. 2013. “Thin-Film Encapsulation Technology for above-IC MEMS Wafer-Level Packaging.” Journal of Micromechanics & Microengineering 23 (12): 125012–21. doi:10.1088/0960-1317/23/12/125012.