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Effect of surface finishes on electromigration reliability in eutectic Sn–58Bi solder joints.
- Source :
-
Microelectronic Engineering . May2014, Vol. 120, p77-84. 8p. - Publication Year :
- 2014
-
Abstract
- Highlights: [•] We studied the failure behavior induced by EM test on the Sn–Bi solder joint. [•] We evaluated the EM reliability of Sn–Bi solder joint on various surface finishes. [•] The Bi was segregated from cathode to anode side. [•] The OSP surface finish showed longer time to failure than others. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 01679317
- Volume :
- 120
- Database :
- Academic Search Index
- Journal :
- Microelectronic Engineering
- Publication Type :
- Academic Journal
- Accession number :
- 95502674
- Full Text :
- https://doi.org/10.1016/j.mee.2013.12.006