Investigation of pre-bending substrate design in packaging assembly of an IGBT power module.

Highlights: [•] Serious warpage of IGBT power module is induced from assembly processes. [•] A pre-bending substrate with a curve opposite the warp is proposed. [•] Design is validated by FEA and related actual measurements. [•] Increasing DBC thickness of Al2O3 layer reduces warps and bonded solder stresses. [•] A thicker base plate is suggested to reduce warping of the entire packaging structure. [ABSTRACT FROM AUTHOR]