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Adsorption of copper ions by ion-imprinted simultaneous interpenetrating network hydrogel: Thermodynamics, morphology and mechanism.

Authors :
Wang, Jingjing
Ding, Liang
Wei, Jun
Liu, Fang
Source :
Applied Surface Science. Jun2014, Vol. 305, p412-418. 7p.
Publication Year :
2014

Abstract

Highlights: [•] Cu(II)-IIH was prepared by free radical/cationic hybrid polymerization. [•] The maximum adsorption capacity was 0.64mmol/g. [•] Cu(II) ion adsorption was a spontaneous and exothermic process. [•] Copper adsorption was mainly through interactions with the amide and ether groups. [Copyright &y& Elsevier]

Details

Language :
English
ISSN :
01694332
Volume :
305
Database :
Academic Search Index
Journal :
Applied Surface Science
Publication Type :
Academic Journal
Accession number :
95825381
Full Text :
https://doi.org/10.1016/j.apsusc.2014.03.102