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Design of Step-Down Broadband and Low-Loss Ruthroff-Type Baluns Using IPD Technology.

Authors :
Chung, Hua-Yen
Chiou, Hwann-Kaeo
Hsu, Yuan-Chia
Yang, Tsung-Yu
Chang, Chia-Long
Source :
IEEE Transactions on Components, Packaging & Manufacturing Technology. Jun2014, Vol. 4 Issue 6, p967-974. 8p.
Publication Year :
2014

Abstract

Ruthroff-type transmission line transformers (TLTs) and baluns prevail over their broadband and low-loss performance. A typical Ruthroff-type balun with a 1:4 step-up impedance transformation ratio was successfully presented using integrated passive devices (IPDs) process. Moreover, two proposed baluns with step-down impedance transformation ratios of 1:1 and 9:4 were developed by modifying the combination of one Ruthroff-type TLT and one Ruthroff-type balun. The two proposed impedance step-down baluns whose balanced impedance is lower than unbalanced impedance make Ruthroff-type balun more flexible for applications; meanwhile, fabricating the baluns using IPD process can help to enhance the low-loss performance. The measured results show that the proposed 1:1 balun exhibits an insertion loss of 0.46 dB with 1-dB fractional bandwidth of 138.9%, and the proposed 9:4 balun exhibits an insertion loss of 0.75 dB with 1-dB fractional bandwidth of 72.4%. The chip areas of the proposed 1:1 and 9:4 baluns, including the pads, are 0.6 and 0.64 mm^2 , respectively. The two proposed baluns are the first on-chip step-down Ruthroff-type baluns and having an option of center tap, which is highly contributive to wideband and high-efficiency power amplifier design. [ABSTRACT FROM PUBLISHER]

Details

Language :
English
ISSN :
21563950
Volume :
4
Issue :
6
Database :
Academic Search Index
Journal :
IEEE Transactions on Components, Packaging & Manufacturing Technology
Publication Type :
Academic Journal
Accession number :
96313114
Full Text :
https://doi.org/10.1109/TCPMT.2014.2311662