Cite
Void Detection in TSVs With X-Ray Image Multithreshold Segmentation and Artificial Neural Networks.
MLA
Wang, Fuliang, and Feng Wang. “Void Detection in TSVs With X-Ray Image Multithreshold Segmentation and Artificial Neural Networks.” IEEE Transactions on Components, Packaging & Manufacturing Technology, vol. 4, no. 7, July 2014, pp. 1245–50. EBSCOhost, https://doi.org/10.1109/TCPMT.2014.2322907.
APA
Wang, F., & Wang, F. (2014). Void Detection in TSVs With X-Ray Image Multithreshold Segmentation and Artificial Neural Networks. IEEE Transactions on Components, Packaging & Manufacturing Technology, 4(7), 1245–1250. https://doi.org/10.1109/TCPMT.2014.2322907
Chicago
Wang, Fuliang, and Feng Wang. 2014. “Void Detection in TSVs With X-Ray Image Multithreshold Segmentation and Artificial Neural Networks.” IEEE Transactions on Components, Packaging & Manufacturing Technology 4 (7): 1245–50. doi:10.1109/TCPMT.2014.2322907.