Cite
Using Ozawa method to study the curing kinetics of electrically conductive adhesives.
MLA
Cui, Hui-Wang, et al. “Using Ozawa Method to Study the Curing Kinetics of Electrically Conductive Adhesives.” Journal of Thermal Analysis & Calorimetry, vol. 117, no. 3, Sept. 2014, pp. 1365–73. EBSCOhost, https://doi.org/10.1007/s10973-014-3902-4.
APA
Cui, H.-W., Jiu, J.-T., Nagao, S., Sugahara, T., Suganuma, K., & Uchida, H. (2014). Using Ozawa method to study the curing kinetics of electrically conductive adhesives. Journal of Thermal Analysis & Calorimetry, 117(3), 1365–1373. https://doi.org/10.1007/s10973-014-3902-4
Chicago
Cui, Hui-Wang, Jin-Ting Jiu, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma, and Hiroshi Uchida. 2014. “Using Ozawa Method to Study the Curing Kinetics of Electrically Conductive Adhesives.” Journal of Thermal Analysis & Calorimetry 117 (3): 1365–73. doi:10.1007/s10973-014-3902-4.