Cite
Low temperature PECVD SiNx films applied in OLED packaging
MLA
Huang, Weidong, et al. “Low Temperature PECVD SiNx Films Applied in OLED Packaging.” Materials Science & Engineering: B, vol. 98, no. 3, Apr. 2003, p. 248. EBSCOhost, https://doi.org/10.1016/S0921-5107(03)00045-X.
APA
Huang, W., Wang, X., Sheng, M., Xu, L., Stubhan, F., Luo, L., Feng, T., Wang, X., Zhang, F., & Zou, S. (2003). Low temperature PECVD SiNx films applied in OLED packaging. Materials Science & Engineering: B, 98(3), 248. https://doi.org/10.1016/S0921-5107(03)00045-X
Chicago
Huang, Weidong, Xuhong Wang, Mei Sheng, Liqiang Xu, Frank Stubhan, Le Luo, Tao Feng, Xi Wang, Fumin Zhang, and Shichang Zou. 2003. “Low Temperature PECVD SiNx Films Applied in OLED Packaging.” Materials Science & Engineering: B 98 (3): 248. doi:10.1016/S0921-5107(03)00045-X.