Cite
Thermophysical properties of SF6-Cu mixtures at temperatures of 300–30,000 K and pressures of 0.01–1.0 MPa: part 2. Collision integrals and transport coefficients.
MLA
Xiaohua Wang, et al. “Thermophysical Properties of SF6-Cu Mixtures at Temperatures of 300–30,000 K and Pressures of 0.01–1.0 MPa: Part 2. Collision Integrals and Transport Coefficients.” Journal of Physics D: Applied Physics, vol. 47, no. 49, Dec. 2014, p. 1. EBSCOhost, https://doi.org/10.1088/0022-3727/47/49/495201.
APA
Xiaohua Wang, Linlin Zhong, Mingzhe Rong, Yann Cressault, & Alain Gleizes. (2014). Thermophysical properties of SF6-Cu mixtures at temperatures of 300–30,000 K and pressures of 0.01–1.0 MPa: part 2. Collision integrals and transport coefficients. Journal of Physics D: Applied Physics, 47(49), 1. https://doi.org/10.1088/0022-3727/47/49/495201
Chicago
Xiaohua Wang, Linlin Zhong, Mingzhe Rong, Yann Cressault, and Alain Gleizes. 2014. “Thermophysical Properties of SF6-Cu Mixtures at Temperatures of 300–30,000 K and Pressures of 0.01–1.0 MPa: Part 2. Collision Integrals and Transport Coefficients.” Journal of Physics D: Applied Physics 47 (49): 1. doi:10.1088/0022-3727/47/49/495201.