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Thermal analysis of COB array soldered on heat sink.
- Source :
-
International Communications in Heat & Mass Transfer . Dec2014, Vol. 59, p55-60. 6p. - Publication Year :
- 2014
-
Abstract
- In this paper, the finite element method (FEM) and experiment were adopted to evaluate the thermal performance of a multi-chip COB LED lamp based on the cold spray technology. The results show that the junction temperature can be limited under 110 °C. Compared to an aluminum-substrate LED module pressed on the heat sink, the soldering structure of a copper-substrate LED can reduce the junction temperature. The junction temperature of the LED module soldered on the heat sink is only 97.3 °C, while one of the pressing structures is 103.5 °C. It is further found that the chip gaps and the thickness of the copper-circuit layer have significant effect on the heat spread. Increasing the chip gaps and the thickness of the copper-circuit layer can effectively reduce the junction temperature and improve the LED lamp's thermal performance. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 07351933
- Volume :
- 59
- Database :
- Academic Search Index
- Journal :
- International Communications in Heat & Mass Transfer
- Publication Type :
- Academic Journal
- Accession number :
- 99740346
- Full Text :
- https://doi.org/10.1016/j.icheatmasstransfer.2014.10.021