Back to Search
Start Over
Deterministic Integration of Out-of-Plane Sensor Arrays for Flexible Electronic Applications.
- Source :
-
Small (Weinheim an der Bergstrasse, Germany) [Small] 2016 Oct; Vol. 12 (37), pp. 5141-5145. Date of Electronic Publication: 2016 Jul 25. - Publication Year :
- 2016
-
Abstract
- A design strategy for fully flexible electrode arrays with out-of-plane through polymer vias (TPVs) for monolithic 3D integration of sensor readout circuitry is presented. The TPVs are formed using copper embedded in thin polyimide structure for support. The copper interconnects offer a stable impedance frequency response from DC to 100 kHz (Z ≈ 20 Ω, θ ≈ 0°).<br /> (© 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.)
Details
- Language :
- English
- ISSN :
- 1613-6829
- Volume :
- 12
- Issue :
- 37
- Database :
- MEDLINE
- Journal :
- Small (Weinheim an der Bergstrasse, Germany)
- Publication Type :
- Academic Journal
- Accession number :
- 27453536
- Full Text :
- https://doi.org/10.1002/smll.201600952