Interference of coexisting copper and aluminum on the ammonium thiosulfate leaching of gold from printed circuit boards of waste mobile phones.

MLA

Jeon, Sanghee, et al. “Interference of Coexisting Copper and Aluminum on the Ammonium Thiosulfate Leaching of Gold from Printed Circuit Boards of Waste Mobile Phones.” Waste Management (New York, N.Y.), vol. 81, Nov. 2018, pp. 148–56. EBSCOhost, https://doi.org/10.1016/j.wasman.2018.09.041.

APA

Jeon, S., Tabelin, C. B., Takahashi, H., Park, I., Ito, M., & Hiroyoshi, N. (2018). Interference of coexisting copper and aluminum on the ammonium thiosulfate leaching of gold from printed circuit boards of waste mobile phones. Waste Management (New York, N.Y.), 81, 148–156. https://doi.org/10.1016/j.wasman.2018.09.041

Chicago

Jeon, Sanghee, Carlito Baltazar Tabelin, Hirotaka Takahashi, Ilhwan Park, Mayumi Ito, and Naoki Hiroyoshi. 2018. “Interference of Coexisting Copper and Aluminum on the Ammonium Thiosulfate Leaching of Gold from Printed Circuit Boards of Waste Mobile Phones.” Waste Management (New York, N.Y.) 81 (November): 148–56. doi:10.1016/j.wasman.2018.09.041.