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Infrared Brazed Joints of Ti 50 Ni 50 Shape Memory Alloy and Ti-15-3 Alloy Using Two Ag-Based Fillers.
- Source :
-
Materials (Basel, Switzerland) [Materials (Basel)] 2019 May 16; Vol. 12 (10). Date of Electronic Publication: 2019 May 16. - Publication Year :
- 2019
-
Abstract
- The wettability, microstructures, and bonding strength of infrared brazing Ti-15-3 and Ti <subscript>50</subscript> Ni <subscript>50</subscript> shape memory alloy using 72Ag-28Cu (wt.%) and 68.8Ag-26.7Cu-4.5Ti (wt.%) filler metals have been investigated. Only Ticusil <superscript>®</superscript> active braze readily wets both Ti <subscript>50</subscript> Ni <subscript>50</subscript> and Ti-15-3 substrates. Wetting of eutectic 72Ag-28Cu melt on Ti <subscript>50</subscript> Ni <subscript>50</subscript> base metal is greatly ameliorated by adding 4.5 wt.% Ti into the alloy. The brazed Ti-15-3/BAg-8/Ti <subscript>50</subscript> Ni <subscript>50</subscript> joint consists of Cu-Ti intermetallics in the Ag-rich matrix. The formation of interfacial Cu(Ti,V) and (Cu <subscript>x</subscript> Ni <subscript>1-x</subscript> ) <subscript>2</subscript> Ti intermetallics next to Ti-15-3 and Ti <subscript>50</subscript> Ni <subscript>50</subscript> substrates, respectively, is attributed to the wetting of both substrates. The brazed Ti-15-3/Ticusil <superscript>®</superscript> /Ti <subscript>50</subscript> Ni <subscript>50</subscript> joint shows a vigorous reaction, which results in the formation of a large amount of Ti <subscript>2</subscript> Ni intermetallics in the joint. The maximum joint strengths using BAg-8 and Ticusil <superscript>®</superscript> filler metals are 197 MPa and 230 MPa, respectively.
Details
- Language :
- English
- ISSN :
- 1996-1944
- Volume :
- 12
- Issue :
- 10
- Database :
- MEDLINE
- Journal :
- Materials (Basel, Switzerland)
- Publication Type :
- Academic Journal
- Accession number :
- 31100807
- Full Text :
- https://doi.org/10.3390/ma12101603