High-quality high-throughput silicon laser milling using a 1 kW sub-picosecond laser.

MLA

Holder, Daniel, et al. “High-Quality High-Throughput Silicon Laser Milling Using a 1 KW Sub-Picosecond Laser.” Optics Letters, vol. 46, no. 2, Jan. 2021, pp. 384–87. EBSCOhost, https://doi.org/10.1364/OL.411412.

APA

Holder, D., Weber, R., Röcker, C., Kunz, G., Bruneel, D., Delaigue, M., Graf, T., & Ahmed, M. A. (2021). High-quality high-throughput silicon laser milling using a 1 kW sub-picosecond laser. Optics Letters, 46(2), 384–387. https://doi.org/10.1364/OL.411412

Chicago

Holder, Daniel, Rudolf Weber, Christoph Röcker, Gerhard Kunz, David Bruneel, Martin Delaigue, Thomas Graf, and Marwan Abdou Ahmed. 2021. “High-Quality High-Throughput Silicon Laser Milling Using a 1 KW Sub-Picosecond Laser.” Optics Letters 46 (2): 384–87. doi:10.1364/OL.411412.